cmr.edu.in M.Tech. in VLSI design & Semiconductor Technology | Programmes at CMR University ...
REQUEST CALL-BACK
Mask group (2) gettyimages-1204089491-2048x2048-transformed (1) 2 (1)

M.Tech. in VLSI design & Semiconductor Technology

graphic graphic

Scope & Objectives

The semiconductor industry is one of the fastest-growing technology sectors globally. The increasing demand for AI hardware, automotive electronics, IoT, communication systems, healthcare devices and consumer electronics has created enormous opportunities for skilled semiconductor engineers.

This programme equips students with expertise in:

  • Semiconductor Device Modelling
  • CMOS Technology
  • VLSI Circuit Design
  • Analog IC Design
  • Digital IC Design
  • Physical Design
  • Verification
  • Device Modelling
  • Process Technology
  • Advanced Packaging
  • Semiconductor Fabrication
  • Research Methodologies

Students will also undertake industry-focused projects, internships and research activities that prepare them for careers in semiconductor companies and higher studies.

Programme Structure

Semester I (22 Credits)

Sl. Code Course Category L-T-P Credits
1 4PGVL2011 Semiconductor Materials and Device Engineering PC 3-0-0 3
2 4PGVL2021 Advanced CMOS Circuit Architecture PC 2-0-1 3
3 4PGVL2031 Digital IC Design Methodologies PC 3-0-1 4
4 4PGVL2041 VLSI Design Laboratory PC 0-0-3 3
5 4PGVL3011 Professional Elective–I PE 4-0-0 4
6 4PGVL3021 Professional Elective–II PE 4-0-0 4
7 4PGRM4011 Research Methodology & Intellectual Property Rights MC 1-0-0 1
8 4PGAC4011 Audit Course–I: Pedagogy Studies AC 0-0-0 0

Total Credits: 22

Semester II (19 Credits)

Sl. Code Course Category L-T-P Credits
1 4PGVL2051 Analogue and Mixed Signal IC Design PC 3-0-1 4
2 4PGVL2061 Physical Design Automation using EDA Tools PC 3-0-1 4
3 4PGVL3031 Professional Elective–III (MOOC Option) PE 4-0-0 4
4 4PGVL3041 Professional Elective–IV PE 4-0-0 4
5 4PGPR4011 Mini Project PR 0-0-3 3
6 4PGAC4021 Audit Course–II: Research Paper Writing AC 0-0-0 0

Total Credits: 19

Semester III (19 Credits)

Sl. Code Course Category L-T-P Credits
1 4PGVL2071 Semiconductor Packaging and Reliability Engineering PC 4-0-0 4
2 4PGVL3611 Open Elective OE 3-0-0 3
3 4PGPR4021 Industry Internship PR 0-0-2 2
4 4PGPR6011 Project Work –Phase I PR 0-0-10 10

Total Credits: 19

Semester IV (15 Credits)

Sl. Code Course Category L-T-P Credits
1 4PGPR6021 Project Work – Phase II & Dissertation PR 0-0-15 15

Total Credits: 15

Programme Assessment

Continuous Internal Evaluation (CIE), Semester End Exam (SEE), Internship, Mini project and Project work

Programme Outcome

i) PO1: An ability to independently carry out research /investigation and development work to solve practical problems.

ii) PO2: An ability to write and present a substantial technical report/document.

iii) PO3: Students should be able to demonstrate a degree of mastery over the area as per the specialisation of the programme. The mastery should be at a level higher than the demands in the appropriate bachelor programme.

What expertise do you gain
  • Semiconductor Device Modelling
  • CMOS Technology
  • VLSI Circuit Design
  • Analog IC Design
  • Digital IC Design
  • Physical Design
  • Process Technology
  • Advanced Packaging
  • Semiconductor Fabrication
dtl-img-graphic3 dtl-img-graphic3-mob
dtl-img-graphic4 dtl-img-graphic4-mob dtl-img

Career Opportunities

Graduates can pursue careers as:

career-op-img1
  • 01
    VLSI Design Engineer
  • 02
    Analogue Design Engineer
  • 03
    Digital Design Engineer
  • 04
    Physical Design Engineer
  • 05
    RTL Design Engineer
  • 06
    ASIC Design Engineer
  • 07
    Verification Engineer
  • 08
    FPGA Engineer
  • 09
    Semiconductor Device Engineer
  • 10
    Process Integration Engineer
  • 11
    TCAD Simulation Engineer
  • 12
    Layout Design Engineer
  • 13
    Product Engineer
  • 14
    CAD Engineer
  • 15
    Failure Analysis Engineer
  • 16
    Semiconductor Research Scientist
  • 17
    Embedded Hardware Engineer
  • 18
    Application Engineer
  • 19
    Design Automation Engineer
  • 20
    Ph.D. Research Scholar

FAQs

2 Years (4 Semesters)

Students receive extensive hands-on training using

  • Silvaco TCAD
  • Cadence Design Suite
  • Xilinx
  • Synapsis

Yes. The curriculum is designed in consultation with semiconductor industry experts and focuses on practical chip design and device modelling.

Students work on

  • Semiconductor Device Simulation
  • Analog IC Design
  • Digital IC Design
  • CMOS Layout
  • Physical Verification
  • ASIC Design Flow
  • Research Projects
  • Industry Internships

Graduates can work in semiconductor companies, chip design firms, EDA companies, R&D organisations, automotive electronics, consumer electronics, defence, communication systems and pursue doctoral research.

Yes. The University has a dedicated placement cell that conducts technical training, soft skill development, internships, industry interactions and placement drives with leading semiconductor and technology companies.

Yes. Students are encouraged to undertake internships and industry-sponsored projects with semiconductor and VLSI organisations.

Yes. Students are encouraged to publish research papers, participate in conferences, file patents and work on funded research projects.

ACCP AY(2026-27)
Seraphinite AcceleratorOptimized by Seraphinite Accelerator
Turns on site high speed to be attractive for people and search engines.